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| Product Name: |
TQFP
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| Specifications |
100L |
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This package change has not only helped to reduce the package size significantly, but also lowered the thermal resistance from 28℃/W to 25℃/W. However, the die orientation within the package has now changed from 'cavity-down' to 'cavity-up', causing the pinout to change.
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| Company: |
windows_ic
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| Contact: |
Ms. amanda nie |
| Address: |
Room3518,B Building,StarsPlaza,Futian District,Shenzhen,Guangdong,CN,518028 |
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| Tel: |
86-755-82709735 |
| Fax: |
86-755-82709301 |
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